ORGANIZING COMMITTEES
Prof. Saidur Rahman, Sunway University, Malaysia
Assoc. Prof. CHING YERN CHEE, University of Malaya, Malaysia
Prof. Gobinda Gopal Khan, Tripura University, India
Prof. Chong Kok Keong Universiti Tunku Abdul Rahman, Malaysia
Prof. Jose Rajan, Universiti Malaysia Pahang, Malaysia
Assoc. Prof. Amit Arora Materials Engineering, Indian Institute of Technology Gandhinagar, India
Prof. Seeram Ramakrishna,National University of Singapore, Singapore
Prof. Jose Rajan Faculty of Industrial Sciences & Technology,Universiti Malaysia Pahang, Malaysia
Prof. George Omollo Owino, Egerton University in Nairobi, Kenya
Dr. Ghanshyam Chemical Engg, Department C G Patel Institute of Technology Uka Tarsadia University,India
Prof. Norhaliza Abdul Wahab, Universiti Teknologi Malaysia, Malaysia
Prof. Keishi Matsuda, Matsuyama University, Japan
Prof. Ikuo IHARA, Nagaoka University of Technology, Japan
Prof. Eckart H. Meiburg, University of California, Santa Barbara
Prof. DAVID BASSIR,French University of Technology,France
Prof. Volkan Kahya, Karadeniz Technical University, Turkey
Prof. David E. Esezobor, University of Lagos, Nigeria
A.Prof. Nour F. Attia, National Institute of Standards (NIS), Egypt
Dr. Lin Feng Ng, Universiti Teknologi Malaysia (UTM), Malaysia
Assis. Prof. Sakineh Chabi, Department of Mechanical Engineering, University of New Mexico, USA
Prof. Ir. Dr. Ts. Abdul Talib bin Din, Universiti Teknikal Malaysia Melaka, Malaysia
Dr. S Vimal, Department of CSE, Ramco Institute of Technology, India
Prof. Luigi Fortuna, University of Catania Department of Electrical, Italy
Prof. Marcello De Falco, University "Campus Bio-Medico" of Rome, Italy
Dr. Narottam Das, University of Southern Queensland, Australia
IMPORTANT DATES
-Submission Portal-
Mail Address: mccm@sub-paper.com
If you have any question or need any assistance regarding the conference, please feel free to contact our conference specialists:
2025-03-28
2025-04-04
2025-04-14
About a week afterthe submission
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E-mail:mccm@sub-paper.com
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